The high power consumption of electronic systems, driven by applications in Artificial Intelligence (AI) and High-Performance Computing (HPC), is generating a significant demand to address overheating ...
Data center workloads continue to surge due to the rise of AI and high-performance computing (HPC), and, in turn, traditional air-cooling methods are reaching their practical limits. As thermal loads ...
At APEC 2025, Nexperia announced several important additions to its portfolio of enhancement-mode GaN and SiC devices. Among them is a new series of 1,200-V SIC MOSFETs available in thermally enhanced ...
Ventiva Introduces Zoned Cooling™: A Breakthrough Design for Laptops, Edge Devices, and Data Centers
LAS VEGAS--(BUSINESS WIRE)--Ventiva®, a leader in thermal solutions, today at CES 2026 unveiled its Zoned Cooling™ reference design, a new architectural approach to thermal management that transforms ...
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Three-layer microfluidic cooling device can remove heat from small electronics more efficiently
As electronic devices become increasingly powerful and compact, they can generate denser heat fluxes, or in other words, produce more heat in a smaller area. These heat fluxes raise the temperature of ...
Ventiva Introduces Zoned Cooling™: A Breakthrough Design for Laptops, Edge Devices, and Data Centers
AI-Ready Laptop Reference Design Demonstrates System-Level Advantages of Ventiva’s New Architectural Approach to Thermal Management Ventiva®, a leader in thermal solutions, today at CES 2026 unveiled ...
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